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Glass cutting
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Glass cutting

Glass cutting

Precision cutting system
According to different requirements, configure lasers of different power and models.
Can meet various cutting requirements
The focused light spot is small, the cutting edge is narrow, and the processing speed is fast./div>
Using high-performance lasers, the laser beam quality is excellent, with high peak power, ultra-narrow pulse width, high repetition frequency and high single-pulse energy.
Consultation
Product Details
Parameter
Parameter Model
Parameter HYLAX MICRO G Series
Laser Type / Wavelength 532nm / 1064nm/ps
Laser Source 10W (Customized by HYLAX)
Material Thickness ＜20mm
Overall Machine Accuracy ±20μm
Stage Positioning Accuracy ±2μm
Stage Repeat Accuracy ±2μm
Cutting Working Area 400*450(mm)
Maximum Power 3KW
Galvanometer Scanner System HYLAX Customized
Spot Diameter 20μm
Operating Ambient Temperature 20±2℃
Ambient Humidity 5℃-40℃,35%-80%RH
Machine Base Material Marble
Power Supply AC220V
Overall Dimension 1400*300*500mm(L*W*H)


Characteristics
According to different requirements, configure lasers of different power and models.
Can meet various cutting requirements
The focused light spot is small, the cutting edge is narrow, and the processing speed is fast.
Using high-performance lasers, the laser beam quality is excellent, with high peak power, ultra-narrow pulse width, high repetition frequency and high single-pulse energy.
The extremely short pulse width ensures that there is no heat conduction during laser processing. Therefore, when processing materials that are sensitive to heat, there will be no thermal influence or stress generated.
Video
 


Application
Mainly used for micro-pores, drilling, slotting and fine cutting and drilling of materials such as mobile phone covers, lens covers, HOME buttons, optical glass, watch covers, sapphire substrates, ultra-thin metal sheet materials, LED sapphire substrates, ceramic substrates, etc.



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