Silicon wafer cutting
Silicon wafer cutting

Silicon wafer cutting

Precision cutting system
Automatic correction, automatic focusing
Automatically check the width of the knife marks
High-definition image recognition system
Real-time display of processing screen for synchronous monitoring of processing status
The water flow control function for cutting can monitor the flow of the cutting water by controlling the image.
Consultation
Product Details
Parameters
Parameters Model
Parameter Name HYLAX MICRO BH Series
Laser Type / Wavelength 1.8KW
Maximum Workpiece Size φ12"or 300*300mm
X-axis cutting range 300mm
Feed Speed Input Range 0.1-500mm/ s
Y-axis cutting range 300mm
Single Step Feed Increment 0.0001mm
Y-Axis Positioning Accuracy < 0.003mm
Z-Axis Effective Stroke 35*35mm
Movement Resolution 0.00005mm
Repeatability Accuracy 0.001 mm
Maximum Axis Rotation Angle 380deg Rated output power of the main shaft
Spindle Rated Output Power 60000kw
Rated Torque 0.29N.m 0.70 N.m
Power Supply AC220V
Compressed Air Supply Pressure 0.5 - 0.8 MPA
Maximum Compressed Air Consumption 200  Umin
Cutting Pressure 0.2 - 0.4 MPA
Maximum Consumption 4.0 Umin
Cooling Water Pressure 0.2-0.4 MPA
Water Consumption L/mi = 1.15 (at 0.3 MPa)
Water Discharge Capacity 5.0 m3/min


Characteristics
Automatic correction, automatic focusing
Automatically check the width of the knife marks
High-definition image recognition system
Real-time display of processing screen for synchronous monitoring of processing status
The water flow control function for cutting can monitor the flow of the cutting water by controlling the image.
Video
 


Application
Suitable for cutting, drilling and marking processing of high-hardness brittle materials such as ceramics and sapphire, as well as various metals. It has wide applications in industries such as aerospace, electronic materials, instruments and meters, and mechanical and electrical products.



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